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HT8972 voice echo block diagram rev. 1.00 1 december 23, 2008 features operating voltage: 4.5v~5.5v adm algorithm low noise echo mode: 85db surround mode: 90db low distortion rate echo mode: 1% surround mode: 0.2% built-in 40kb sram automatic reset function 16-pin dip/sop package applications television karaoke systems video disc player sound equipments general description the HT8972 is an echo/surround effect processor. it is designed for various audio systems including karaoke, television, sound equipments, etc. the chip consists of a built-in pre-amplifier, vco or voltage control osc, 40kb sram, a/d and d/a converters as well as delay time control logic. its built-in 40kb sram can generate delay time effect and can control the delay time value through the exter - nal vco resistor. the vco circuit can reduce external components and make it easy to adjust the delay time.

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pin assignment pad assignment chip size: 2475 2065 ( m) 2 * the ic substrate should be connected to vss in the pcb layout artwork. HT8972 rev. 1.00 2 december 23, 2008

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pad coordinates unit: m pad no. x y pad no. x y 1 883.875 861.250 9 1027.425 892.700 2 865.105 891.900 10 907.375 890.431 3 564.105 892.700 11 715.175 890.429 4 44.775 892.700 12 467.375 890.431 5 147.425 892.700 13 275.175 890.429 6 395.225 892.700 14 60.790 879.700 7 587.425 892.700 15 203.150 868.440 8 835.225 892.700 16 783.875 861.250 pad description pad no. pad name i/o internal connection description 1 dgnd i digital ground 2 osc_o o system oscillator output 3 vco i system oscillator input, system frequency adjustable pin 4 cc1 current control 1 5 cc0 current control 0 6 op1_out o op1 output 7 op1_in i op1 input 8 op2_in i op2 input 9 op2_out o op2 output 10 lpf2_in i low pass filter 2 input 11 lpf2_out o low pass filter 2 output 12 lpf1_out o low pass filter 1 output 13 lpf1_in i low pass filter 1 input 14 vcc i analog and positive power supply 15 ref i analog reference voltage 16 agnd i analog ground absolute maximum ratings supply voltage ...........................v ss 0.3v to v ss +6.0v storage temperature ............................ 50 cto125 c input voltage..............................v ss 0.3v to v dd +0.3v operating temperature ............................. 20 cto70 note: these are stress ratings only. stresses exceeding the range specified under absolute maximum ratings may cause substantial damage to the device. functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability. HT8972 rev. 1.00 3 december 23, 2008
electrical characteristics ta=25 c symbol parameter test conditions min. typ. max. unit v dd conditions v cc operating voltage 4.5 5.0 5.5 v i cc operating current 5v 15 30 ma g v voltage gain 5v r l =47k 0.9 2.5 db v omax maximum output voltage 5v thd=10% 0.9 1.8 vrms thd total harmonic distortion 5v filter= a weighting 0.7 1.5 % n o output noise voltage 5v filter= a weighting 85 60 dbv psrr power supply rejection ratio 5v v cc = 20dbv (0.1vrms) f=100hz 40 30 db HT8972 rev. 1.00 4 december 23, 2008
HT8972 rev. 1.00 5 december 23, 2008 , - . /
functional description the HT8972 is an echo/surround effect generator with built-in 40kb sram. it ensures low distortion as well as low noise for processing audio signal delay. the chip provides two playing modes (echo and surround) and the playing function block diagrams are shown as fol - lows. surround mode echo mode r osc -f osc -delay_time-distortion cross table r osc 56.2 44 36.3 30.6 25.9 23.1 20.7 k f osc 2 2.5 3 3.5 4 4.5 5 mhz td 320 264 219 188 164 147 132 ms thd 1.3 1.05 0.815 0.625 0.58 0.525 0.43 % r osc 18.5 16.7 15.1 14.5 13.9 11.9 10.9 k f osc 5.5 6 6.5 7 7.5 8 8.5 mhz td 120 110 102 93 88 82 78 ms thd 0.4 0.335 0.315 0.3 0.275 0.26 0.25 % r osc 10 9 8.06 7.3 6.4 5.8 5.3 k f osc 9 101112131415mhz td 73.2 65.6 59.2 54.4 50 46 44 ms thd 0.23 0.218 0.205 0.19 0.17 0.1675 0.1575 % r osc 4.8 4.4 4 3.7 3.3 3 2.8 k f osc 16 17 18 19 20 21 22 mhz td 41.2 38.4 36 33.6 33 32 30 ms thd 0.16 0.145 0.14 0.14 0.13 0.125 0.12 % , - . /

application circuits echo mode note: 1. : analog ground, : digital ground 2. when the value of the rosc increases, the range of the delay time also increases. please refer to the r osc -f osc -delay_time-distortion cross table for the r osc & delay time values. HT8972 rev. 1.00 6 december 23, 2008 &

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surround mode note: 1. : analog ground, : digital ground 2. when the value of the rosc increases, the range of the delay time also increases. please refer to the r osc -f osc -delay_time-distortion cross table for the r osc & delay time values. HT8972 rev. 1.00 7 december 23, 2008 &

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package information 16-pin dip (300mil) outline dimensions ms-001d (see fig1) symbol dimensions in mil min. nom. max. a 780 880 b 240 280 c 115 195 d 115 150 e14 22 f45 70 g 100 h 300 325 i 430 ms-001d (see fig2) symbol dimensions in mil min. nom. max. a 735 775 b 240 280 c 115 195 d 115 150 e14 22 f45 70 g 100 h 300 325 i 430 HT8972 rev. 1.00 8 december 23, 2008 $ ' ( 7 fig1. full lead packages $ ' ( 7 fig2. 1 / 2 lead packages
mo-095a (see fig2) symbol dimensions in mil min. nom. max. a 745 785 b 275 295 c 120 150 d 110 150 e14 22 f45 60 g 100 h 300 325 i 430 HT8972 rev. 1.00 9 december 23, 2008
16-pin sop (300mil) outline dimensions ms-013 symbol dimensions in mil min. nom. max. a 393 419 b 256 300 c12 20 c
398 413 d 104 e 50 f4 12 g16 50 h8 13 0 8 HT8972 rev. 1.00 10 december 23, 2008 $ ' ( 7 8
product tape and reel specifications reel dimensions sop 16w (300mil) symbol description dimensions in mm a reel outer diameter 330.0 1.0 b reel inner diameter 100.0 1.5 c spindle hole diameter 13.0 +0.5/-0.2 d key slit width 2.0 0.5 t1 space between flange 16.8 +0.3/-0.2 t2 reel thickness 22.2 0.2 HT8972 rev. 1.00 11 december 23, 2008
carrier tape dimensions sop 16w (300mil) symbol description dimensions in mm w carrier tape width 16.0 0.2 p cavity pitch 12.0 0.1 e perforation position 1.75 0.10 f cavity to perforation (width direction) 7.5 0.1 d perforation diameter 1.50 +0.10/-0.00 d1 cavity hole diameter 1.50 +0.25/-0.00 p0 perforation pitch 4.0 0.1 p1 cavity to perforation (length direction) 2.0 0.1 a0 cavity length 10.9 0.1 b0 cavity width 10.8 0.1 k0 cavity depth 3.0 0.1 t carrier tape thickness 0.30 0.05 c cover tape width 13.3 0.1 HT8972 rev. 1.00 12 december 23, 2008 9 0 . " . : , 0 6 . 6 2 3 , 5 , , - 3 # - , . 5 , - # " . , 2 # 6 3 , . 4 , 2 , , , - 7 # - ,
HT8972 rev. 1.00 13 december 23, 2008 copyright 2008 by holtek semiconductor inc. the information appearing in this data sheet is believed to be accurate at the time of publication. however, holtek as - sumes no responsibility arising from the use of the specifications described. the applications mentioned herein are used solely for the purpose of illustration and holtek makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. holtek
s products are not authorized for use as critical components in life support devices or systems. holtek reserves the right to alter its products without prior notification. for the most up-to-date information, please visit our web site at http://www.holtek.com.tw. holtek semiconductor inc. (headquarters) no.3, creation rd. ii, science park, hsinchu, taiwan tel: 886-3-563-1999 fax: 886-3-563-1189 http://www.holtek.com.tw holtek semiconductor inc. (taipei sales office) 4f-2, no. 3-2, yuanqu st., nankang software park, taipei 115, taiwan tel: 886-2-2655-7070 fax: 886-2-2655-7373 fax: 886-2-2655-7383 (international sales hotline) holtek semiconductor inc. (shanghai sales office) g room, 3 floor, no.1 building, no.2016 yi-shan road, minhang district, shanghai, china 201103 tel: 86-21-5422-4590 fax: 86-21-5422-4705 http://www.holtek.com.cn holtek semiconductor inc. (shenzhen sales office) 5f, unit a, productivity building, gaoxin m 2nd, middle zone of high-tech industrial park, shenzhen, china 518057 tel: 86-755-8616-9908, 86-755-8616-9308 fax: 86-755-8616-9722 holtek semiconductor inc. (beijing sales office) suite 1721, jinyu tower, a129 west xuan wu men street, xicheng district, beijing, china 100031 tel: 86-10-6641-0030, 86-10-6641-7751, 86-10-6641-7752 fax: 86-10-6641-0125 holtek semiconductor inc. (chengdu sales office) 709, building 3, champagne plaza, no.97 dongda street, chengdu, sichuan, china 610016 tel: 86-28-6653-6590 fax: 86-28-6653-6591 holtek semiconductor (usa), inc. (north america sales office) 46729 fremont blvd., fremont, ca 94538, usa tel: 1-510-252-9880 fax: 1-510-252-9885 http://www.holtek.com

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